Studi elektrokimia tembaga dari printed circuit board (PCB) dengan larutan asam klorida (HCl) dan aditif hidrogen peroksida (H2O2) = Electrochemical study of copper leaching in printed circuit board with hydrochloric acid (HCl) and additive hydrogen peroxide (H2O2)

Studi elektrokimia pelindian tembaga pada printed circiut board menggunakan larutan asam nitrat (HNO3) dengan variasi konsentrasi asam nitrat dan waktu celup = Electrochemical study of copper leaching in printed circuit board with nitric acid solution (HNO3) using variation of nitric acid concentration and immersion time

Pengaruh konsentrasi karbon aktif terhadap peningkatan kadar logam emas pada pelindian limbah printed circuit board dalam media asam klorida = Effect of concentration of activated carbon to gold metal recovery of printed circuit board leaching in hydrochloric acid

Studi Evolusi Partikel Leached Printed Circuit Board (PCB) pada Proses Wet Milling Menggunakan Process Control Agent Ethanol = Study of the Evolution of Leached Printed Circuit Board (PCB) during Wet Milling Process Using Ethanol as Process Control Agent

Studi Evolusi Partikel Leached Printed Circuit Board (PCB) Pada Proses Dry Milling = Study of Particle Evolution in Leached Printed Circuit Board (PCB) during Dry Milling