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Hasil Pencarian

Ditemukan 5 dokumen yang sesuai dengan query
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ISTFA '97: proceedings of the 23rd International Symposium for Testing and Failure Analysis, 27-31 October 1997, Santa Clara Convention Center, Santa Clara, California
" Contents : - Testing-Based Failure Analysis: A Critical Component of the SIA Roadmap Vision - Experimental Figures for the Defect Coverage of IDDQVectors - A CAD-Based Approach to Failure Diagnosis of CMOSLSI with Single Fault Using Abnormal IDDQ - Test and Failure Analysis Implications of a Novel Inter-Bit Dependency in a Non- Volatile Memory - Analysis of a Latent Deep Submicron CMOS Device Isolation Leakage Mechanism - ... "
Materials Park, Ohio: ASM International, 1997
e20442506
eBooks  Universitas Indonesia Library
cover
ISTFA '98: proceedings of the 24th International Symposium for Testing and Failure Analysis, 15-19 November 1998, Hyatt Regency DFW, Dallas, Texas
" Contents : - Keynote Presentation - Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup - Session 1: Advanced Techniques - Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in Shallow Trench Isolation CMOS Structures: Correlation With Defect Generation and Diode Leakage - Microthermal Imaging Based on the Transmission Change ... "
Materials Park, Ohio: ASM International, 1998
e20442507
eBooks  Universitas Indonesia Library
cover
ISTFA '99: proceedings of the 25th international symposium for testing and failure analysis, 14-18 November 1999, Westin Hotel Santa Clara, California
" Contents : - Terahertz Imaging: A New Technique for Inspection of Dielectric Materials - Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy - Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing - Optical Probing of VLSI IC’s from the Silicon Backside - Picosecond Imaging Circuit Analysis of the IBM G6 Microprocessor Cache - Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated ... "
Materials Park, Ohio: ASM International, 1999
e20442508
eBooks  Universitas Indonesia Library
cover
ISTFA 2000: proceedings of the 26th International Symposium for Testing and Failure Analysis, 12-16 November 2000, Meydenbauer Convention Center, Bellevue, Washington
" Contents : - Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors - Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation - Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis - Measurement of Interfacial Adhesion and Its Degradation in Multi-Layer Packages, Devices, And Blanket Films Using the Laser Spallation Technique - ... "
Materials Park, Ohio: AsM International, 2000
e20442548
eBooks  Universitas Indonesia Library
cover
ISTFA 2008: conference proceedings from the 34th International Symposium for Testing and Failure Analysis, November 2-6, 2008, Oregon Convention Center, Portland, Oregon, USA
" This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results ... "
Materials Park, Ohio: ASM International, 2008
e20442550
eBooks  Universitas Indonesia Library