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"[ABSTRAKMaterial solder saat ini banyak menggunakan Sn-Pb. Saat ini ada permasalahan lingkungan yaitu Pb yang bersifat racun. Selain itu terjadi fenomena Whiskers yang dapat menyebabkan hubungan pendek pada peralatan elektronikTelah dilakukan sintesa material solder bebastimbal Sn-0.7Cu-xBi/Zn. Pada sampel dilakukan karakterisasi x-ray difraksi. Dilakukan analisis Rietveld untukm emperoleh parameter kristalografidant eksturpa daarah bidang tertentu untuk melihat fenomena whisker.Hasilanilisa Rietveld memperlihatkan penambahan unsurBismut dengan konsentrs i tertentu pada paduan Sn-0.7Cu-xBi dapat merubah teksturpada bidang kristalografi tertentu ditandai dengant ingginya kerapatan pole figure yang dapat diartik antingginya keseragaman orientasikristalit yang dapat menja di penghambat whiskers dibidangtersebut.;

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ABSTRACTSolder material is using Lead (Pb) recently. Toxity of lead was creating environtment issue now. Beside of that whiskers phenomena could make short at electronics circuits.Synthesis of Sn-0.7Cu-xBi/Zn lead free solder materials have been conducted. These alloys were being characterized by using XRD diffractometer. Crystallographic paratemeters and texture of certain plane have been extracted to observe whiskers phenomenaThe result from Rietveld refinement show that adding certain Bismuth concentration could change texture of Sn-0.7Cu-xBi alloy at certain crystall plane. This condition was being show by high density of pole figure, means crystallite orientation more uniform. High density of pole figure at certain crystall plane could become whisker inhibitor.;Solder material is using Lead (Pb) recently. Toxity of lead was creating environtment issue now. Beside of that whiskers phenomena could make short at electronics circuits.Synthesis of Sn-0.7Cu-xBi/Zn lead free solder materials have been conducted. These alloys were being characterized by using XRD diffractometer. Crystallographic paratemeters and texture of certain plane have been extracted to observe whiskers phenomenaThe result from Rietveld refinement show that adding certain Bismuth concentration could change texture of Sn-0.7Cu-xBi alloy at certain crystall plane. This condition was being show by high density of pole figure, means crystallite orientation more uniform. High density of pole figure at certain crystall plane could become whisker inhibitor., Solder material is using Lead (Pb) recently. Toxity of lead was creating environtment issue now. Beside of that whiskers phenomena could make short at electronics circuits.Synthesis of Sn-0.7Cu-xBi/Zn lead free solder materials have been conducted. These alloys were being characterized by using XRD diffractometer. Crystallographic paratemeters and texture of certain plane have been extracted to observe whiskers phenomenaThe result from Rietveld refinement show that adding certain Bismuth concentration could change texture of Sn-0.7Cu-xBi alloy at certain crystall plane. This condition was being show by high density of pole figure, means crystallite orientation more uniform. High density of pole figure at certain crystall plane could become whisker inhibitor.]"

"The topics addressed in this proceedings volume include active brazing (an area of increasing R&D interest); conventional brazing an soldering alloys; wetting and fundamental properties studies; modeling and mechanical analysis and/or characterization; and process technology. All of the papers in this volume have been editorially reviewed. Both the hardcopy and CD contain an author s index for easy reference, and the CD volume is fully searchable by keyword."

"If you work with soldering processes or soldered components, Principles of Soldering will help you understand and solve practical engineering challenges. Clearly written and well referenced, this book takes you from the fundamental characteristics of solders, fluxes, and joining environments to the impact these have in the selection and successful use of soldering processes. Priority is given to the fundamental principles that underlie this field of technology rather than recipes for making joints. Striking a balance between being unduly simplistic or overly mathematical in their approach, the authors provide the critical analysis that is missing from much of the literature on soldering. An entire section is devoted to the difficult art of fluxless soldering and includes strategies for devising successful processes. The final chapter is devoted to recent advances in soldering technology and covers a variety of topics including lead-free solders, flip-chip interconnection, diffusion soldering, amalgams as solders, composite solders and other hot areas of research. Containing approximately 200 figures and 60 tables, this book updates and greatly expands the soldering content in the book Principles of Soldering and Brazing (1993) by the same authors. A companion volume, Principles of Brazing, is in development."

"Paduan timah-timah (Sn-Pb) adalah yang paling banyak digunakan di Indonesia sebagai bahan solder. Timbal adalah unsur beracun dan harus diganti oleh unsur lain. Tujuan dari Penelitian ini mempelajari bahan solder bebas timbal Sn-Zn dengan berbagai konten Zn. Timah diperoleh dari Pulau Bangka. Sampel dikarakterisasi dengan cara Difraktometer Sinar-X, penganalisis termal, dan Potensiodinamik. Hasilnya menunjukkan bahwa dengan berbagai konten Zn yang berbeda, struktur tetragonal tetap berpusat pada Tubuh. Konten Zn yang berbeda dalam Paduan Sn-Zn telah mengubah titik lebur dan entalpi. Tes Polarisasi Potensiodinamik menunjukkan bahwa Sn-Zn berbeda kandungan Zn stabil secara kimiawi. Dapat disimpulkan bahwa Paduan Sn-Zn dapat digunakan sebagai salah satu di antara solder bebas timah lainnya. Kandungan Zn lebih rendah dari eutektik konsentrasi menghasilkan laju korosi terkecil.Paduan timah-timah (Sn-Pb) adalah yang paling banyak digunakan di Indonesia sebagai bahan solder. Timbal adalah unsur beracun dan harus diganti oleh unsur lain. Tujuan dari Penelitian ini mempelajari bahan solder bebas timbal Sn-Zn dengan berbagai konten Zn. Timah diperoleh dari Pulau Bangka. Sampel dikarakterisasi dengan cara Difraktometer Sinar-X, penganalisis termal, dan Potensiodinamik. Hasilnya menunjukkan bahwa dengan berbagai konten Zn yang berbeda, struktur tetragonal tetap berpusat pada Tubuh. Konten Zn yang berbeda dalam Paduan Sn-Zn telah mengubah titik lebur dan entalpi. Tes Polarisasi Potensiodinamik menunjukkan bahwa Sn-Zn berbeda kandungan Zn stabil secara kimiawi. Dapat disimpulkan bahwa Paduan Sn-Zn dapat digunakan sebagai salah satu di antara solder bebas timah lainnya. Kandungan Zn lebih rendah dari eutektik konsentrasi menghasilkan laju korosi terkecil.

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Lead-complaint (Sn-Pb) is the most widely used in Indonesia as a solder. Lead is a poisonous element and must be replaced by other elements. The purpose of this research is to study Sn-Zn lead free solder with various contents Zn. Tin is obtained from Bangka Island. Samples were characterized by X-ray Difractometer, thermal analyzer, and Potentiodynamics.

The results show that with a variety of different Zn content, the tetragonal structure remains centered on the Body. The different Zn content in the Sn-Zn Alloy has changed the melting point and enthalpy. Potentiodynamic Polarization Tests showed that Sn-Zn differed chemically stable Zn content.

It can be concluded that the Sn-Zn Alloy can be used as one of the other lead-free solder. Zn content is lower than eutectic concentration produces the smallest corrosion rate. The combination of lead (Sn-Pb) is the most widely used in Indonesia as a solder. Lead is a poisonous element and must be replaced by other elements.

The purpose of this research is to study Sn-Zn lead free solder with various Zn contents. Tin is obtained from Bangka Island. Samples were characterized by X-ray Difractometer, thermal analyzer, and Potentiodynamics. The results show that with a variety of different Zn content, the tetragonal structure remains centered on the Body. The different Zn content in the Sn-Zn Alloy has changed the melting and enthalpy points.

Potentiodynamic Polarization Tests showed that Sn-Zn differed chemically stable Zn content. It can be concluded that the Sn-Zn Alloy can be used as one of the other lead-free solder. The lower Zn content than the eutectic concentration produces the smallest corrosion rate."

"Perkembangan industri elektronik di Indonesia semakin maju pesat dan tentunya membutuhkan tingkat akurasi produksi yang tinggi serta proses yang ramah terhadap lingkungan. Paduan solder SnPb perlu ditinjau karena sudah dilarang pengunaanya mulai 1 juli 2006 di negara maju mengingat sifat toxic Pb yang sangat berbahaya. Sebagai salah satu alternatif untuk mengganti unsur Pb maka dilakukan modifikasi unsur Zn yang dipadukan dengan unsur timah (Sn) dan tembaga(Cu) untuk memperoleh sifat fisik dan mekanik yang mendekati sifat SnPb. Metoda penggabungan secara metalurgi pada proses pembasahan dengan dasar sudut kontak dan pencapaian suhu solidus juga sebagai bentuk karakterisasi yang diperlukan. Pengujian dilakukan terhadap paduan terner Sn-0.7Cu-xZn dengan metoda peleburan Sn dan Cu yang dilanjutkan dengan penambahan variasi unsur Zn 22,24;19,37;16,47,15,14;14,29 dan 9,08 % dan dilakukan pengujian temperatur leleh (DSC test) serta pengujian pemanasan diatas tembaga,, mampu basah (wettability), tegangan geser (shear stress),kerapatan massa(density), kekerasan mikro dan makro(Micro and Macro hardness), dan pengamatan struktur mikro. Hasil pengujian menunjukkan bahwa penambahan kandungan Zn pada paduan terner berbasis Sn-0.7Cu-xZn akan menurunkan temperatur leleh secara signifikan. Kekuatan geser paduan terner terbesar diperoleh pada penambahan 9,08% Zn serta terkecil diperoleh pada penambahan 22,24 % Zn. Tingkat kekerasan paduan terner Sn0.7CuxZn terbesar diperoleh pada prosentase 22,24 % Zn dan terkecil diperoleh pada prosentase 9,08% Zn. Adapun dari pengamatan struktur mikro terlihat bahwa sebaran fasa intermetalik Cu3Sn dan fasa eutektik Sn cukup signifikan terjadi pada paduan Sn0.7CuxZn.

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Electronic industrial has developed rapidly as customer consumption. So that for an accuracy level and environmentally friendly is needed as base on production process. SnPb soldering is banned in developed country since july 2006, then the aim is to explore the material which have to eliminate Pb by using other free lead element to void toxic of lead solder as human health and environment protection. One of the potential element was studied is Zinc alloyed Tin and Copper on variety composition of Zinc. The method was carried out by using XRD measurement, microstructure observation and melting point tested to analyses hardness, shear strength and wettability behavior.

Experimentally as shown that increasing of Zn (22,24;19,37;16,47;15,14;14,29 and 9,08) has effect to physically and mechanical properties. Shear stress on terner alloys has higher value in 22,24%Zn, and lower value in 14,29%Zn. Hardness level on terner alloys has higher value in 14,29%Zn and lower value in 12%Zn. Melting point has decreasing in increasing of Zinc content. Metallography observation has identified that intermetalic Cu3Sn and eutectic Sn are scattered in Sn0.7CuxZn alloy."

"Pada penelitian ini dilakukan pembuatan dan karakterisasi sampel Sn - Cu menggunakan XRF, XRD dan SEM. Penentuan kapasitas panas sebagai fungsi temperatur Cp (T) dari material solder Sn ? Cu menggunakan alat uji DSC dari suhu 31° C hingga 400 °C dan laju 5 °C/menit. Material solder Sn ? Cu pada penelitian ini berasal dari unsur-unsur murninya yang dicampur,digerus dengan mortar sekitar 10 menit dan kemudian dilebur pada suhu sekitar 700 °C selama 10 sampai 15 menit. Persen berat Cu dibanding Sn yang digunakan adalah 0,2 %, 1,1%, 1,2 % dan 1,9%. Kapasitas panas paduan logam Sn ? Cu sebagai fungsi temperatur sebagai berikut :Cp (T ) = a + b T + c T2 J/mol. K. Dimana a, b dan c adalah konstanta yang tergantung pada jenis material. Hasil menunjukkan bahwa dengan kenaikan Cu, menurunkan kapasitas panas sampel Sn - Cu dan cenderung menghambat pertumbuhan Kristal Sn.

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This experiment focusing on making and characterizing sample Sn - Cu by using XRF, XRD and SEM. Measuring the heat capacity Cp (T) by using DSC at temperature 31° C to 400 °C and the heat flow 5 °C/minute. Soldering material that is used in this experiment made from its pure material, blended and grinded using mortar for approximately 10 minutes and then heated to 700 °C for approximately 10 to 15 minutes. The sample consist of 0,2%, 1,1% , 1,2% and 1,9% weight of Cu. The heat capacity of the sample can be calculated by the formula Cp (T ) = a + b T + c T2J/mol. Where a, b and c are the constants according to each material. The result of thid experiment shows that the addition of copper to each SnCu sample may lower the melting temperature, heat capacity and tendence to inhibit the crystal size of Sn."

"This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed. Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. The results of these studies have been reported rather sporadically at various technical conferences."

"Meningkatnya kekhawatiran terhadap dampak dari penggunaan Pb dari sisi kesehatan mendorong industri-industri elektronik mulai mencari material solder bebas Pb. Paduan yang berpotensi sebagai material solder pengganti Sn-Pb adalah Sn-0,7Cu, tetapi paduan tersebut memiliki titik leleh tinggi yaitu 216-227 ◦C, paduan lain yang berpotensi besar adalah Sn-9Zn dengan titik leleh 199° C, tetapi Zn sangat mudah teroksidasi dan mengalami korosi. Pada penelitian ini akan dilakukan pembuatan dan karakterisasi paduan 3 logam (ternary system) yaitu Sn-Zn-Cu, paduan baru ini diharapkan dapat memperbaiki kelemahan dari paduan Sn-Cu dan Sn-Zn. Karakterisasi paduan logam Sn-Cu-Zn menggunakan XRF (X-Ray Fluorescence) dan XRD (X-Ray Diffraction) menunjukkan adanya logam Sn, Cu dan Zn dalam setiap paduan logam dengan komposisi (% berat) Sn-0,8Cu, Sn-0,6Cu-10,4Zn dan Sn-0,5Cu-23,6Zn. Paduan logam Sn-0,5Cu-23,6Zn adalah paduan logam yang paling berpotensi sebagai pengganti Sn-37Pb, dengan titik leleh terendah 204,13 oC, nilai pasty range 9,33 oC yang mendekati paduan logam Sn-37Pb dan nilai heat of fusion/ΔH 65,33 J/g yang lebih rendah dari paduan Sn-37Pb.

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Increasing concerns over the impact of the use of Pb from the health side drive electronics industries began to search for Pb-free solder material. Alloy material that has potential as a substitute for Sn-Pb solder is Sn-0.7Cu, but these alloys have high melting point is 216-227 ◦C, another potential alloys are Sn-9Zn in melting point of 199 ° C, but Zn is susceptible to oxidation and corrosion experience. This research will be done the manufacture and characterization of metal alloy 3 (ternary system) the Sn-Zn-Cu, the new alloy is expected to improve the weaknesses of the alloy Sn-Cu and Sn-Zn. Characterization metal alloy Sn-Cu-Zn used XRF (X-Ray Fluorescence) and XRD (X-Ray Diffraction) indicate the presence of metallic Sn, Cu and Zn in each metal alloy with a composition (wt%) Sn-0.8Cu, Sn-0.6Cu-10.4Zn dan Sn-0.5Cu-23.6Zn. Sn-0.5Cu-23.6Zn is metal alloy with the most potential as a replacement for Sn-37Pb, with the lowest melting point 204.13 °C, the pasty range is close to 9.33 ° C metal alloy Sn-37 Pb and the heat of fusion/ΔH 65.33 J/g lower than Sn-37Pb alloy. Surface characterization using SEM (Scanning Electron Microscopy) show the existence of phases rich in Sn, Cu-Zn and Zn-rich alloy surfaces supported by the data of EDS (Energy Dispersive X-Ray Spectroscopy)."