Ditemukan 17 dokumen yang sesuai dengan query
Villanucci, Robert S.
Englewood Cliffs, NJ: Prentice-Hall, 1982
621.381 5 VIL e
Buku Teks Universitas Indonesia Library
"
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results ...
"
Materials Park, Ohio: ASM International, 2010
e20451716
eBooks Universitas Indonesia Library
Villanucci, Robert S.
Englewood Cliffs, NJ: Prentice-Hall, 1981
621.381 VIL e
Buku Teks Universitas Indonesia Library
"
Contents :
- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging
Techniques in CMOS Failure Analysis
- Infrared Light Emission From Semiconductor Devices
- The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI
Circuits
- Golden Devices II: Alchemy in the 0.35 um Era
- Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip
- Two ...
"
Materials Park, Ohio: ASM International, 1996
e20442490
eBooks Universitas Indonesia Library
"
In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution up to 3.5 times better than without the lens. This method is easily implemented with standard equipment already present in most failure analysis laboratories, and ...
"
Materials Park, Ohio: ASM International, 2005
e20442491
eBooks Universitas Indonesia Library
Morgan, David
"
This major reference book is aimed at engineers and technical managers concerned with EMC (electromagnetic compatibility). It explains why EMC testing is necessary, what standards must be met, how such testing is carried out (and therefore how to prepare for it), what accuracy and repeatability can be expected, and when to test. For less than the cost of half a day's testing in a laboratory, with this book manufacturers of equipment can prepare for and ...
"
London: International Engineering Consortium, 2007
e20452027
eBooks Universitas Indonesia Library
"
Contents :
- Foreword
- The Microelectronics Desk Reference
- System Level Failure Analysis Process: Making Failure Analysis a Value Add
Proposition in today’s High Speed Low Cost PC environment
- Board Level Failure Mechanisms and Analysis in Hand-held Electronic Products
- Failure Analysis Flow for Package Failures
- Wafer Level Failure Analysis Process Flow
- Flip-Chip and “Backside” Sample Preparation Techniques
- Failure Analysis in a ...
"
Materials Park, Ohio: ASM International, 2004
e20442591
eBooks Universitas Indonesia Library
"
Contents :
- Microelectronics failure analysis desk reference, 2001 supplement
- Preface
- Microelectronic Failure Analysis Desk Reference 2001 Supplement
- FIB Backside Isolation Techniques
- The SEM Lab, From Laboratory Logistics to Final Sample Preparation
Techniques for SEM Analysis of Semiconductors
- Cross Sectioning with a Pivoting Sample Block
- Focused Ion Beam Cross Sectioning as a Compliment or an Alternative to
Conventional Mechanical Sectioning ...
"
Materials Park, Ohio: ASM International, 2001
e20442592
eBooks Universitas Indonesia Library
"
Contents
- IPFA 2000 Best Paper Award Winner
- Application of Focused Ion Beam System as a Defect Localization and Root
Cause Analysis Tool
- Session 1: Advanced Techniques 1
- X-Ray Tomography of Integrated Circuit Interconnects: Past and Future
- X-ray Nanotomog Raphy (XRMT) Tool for Non-Destructive High-Resolution
Imaging of ICs
- Single Point PICA Probing with an Avalanche Photo-Diode
- Session 2: ...
"
Materials Park, Ohio: ASM International, 2001
e20442603
eBooks Universitas Indonesia Library
"
Contents :
- Foreword
- The Microelectronics Desk Reference
- System Level Failure Analysis Process: Making Failure Analysis a Value Add
Proposition in today’s High Speed Low Cost PC environment
- Board Level Failure Mechanisms and Analysis in Hand-held Electronic Products
- Failure Analysis Flow for Package Failures
- Wafer Level Failure Analysis Process Flow
- Flip-Chip and “Backside” Sample Preparation Techniques
- Failure Analysis in ...
"
Materials Park, Ohio: ASM International, 2004
e20442620
eBooks Universitas Indonesia Library
