Ditemukan 3 dokumen yang sesuai dengan query
Lau, John H.
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Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), ...
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Springer Nature, 2019
e20508943
eBooks Universitas Indonesia Library
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Heterogeneous embedded systems, signal representations and different abstraction levels, architectures and components based on hardware and software, in all the main phases of design (modeling, validation with multiple models of computation, synthesis and optimization). It concentrates on the specific issues at the interfaces, and is divided into two main parts. The first part examines mainly theoretical issues and focuses on the modeling, validation and design techniques themselves. The second part illustrates the use of these ...
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Dordrecht, Netherlands: [Springer, Springer], 2012
e20398193
eBooks Universitas Indonesia Library
Uchiyama, Kunio
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This book defines the heterogeneous multicore architecture and explains in detail several embedded processor cores including CPU cores and special-purpose processor cores that achieve highly arithmetic-level parallelism. The authors developed three multicore chips (called RP-1, RP-2, and RP-X) according to the defined architecture with the introduced processor cores. The chip implementations, software environments, and applications running on the chips are also explained in the book.
Provides readers an overview and practical discussion of heterogeneous multicore technologies ...
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New York : Springer, 2012
e20425837
eBooks Universitas Indonesia Library
