Ditemukan 10 dokumen yang sesuai dengan query
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Contents :
- Testing-Based Failure Analysis: A Critical Component of the SIA Roadmap Vision
- Experimental Figures for the Defect Coverage of IDDQVectors
- A CAD-Based Approach to Failure Diagnosis of CMOSLSI with Single Fault
Using Abnormal IDDQ
- Test and Failure Analysis Implications of a Novel Inter-Bit Dependency in a Non-
Volatile Memory
- Analysis of a Latent Deep Submicron CMOS Device Isolation Leakage
Mechanism
- ...
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Materials Park, Ohio: ASM International, 1997
e20442506
eBooks Universitas Indonesia Library
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Contents :
- Keynote Presentation
- Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That
an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup
- Session 1: Advanced Techniques
- Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in Shallow
Trench Isolation CMOS Structures: Correlation With Defect Generation and Diode
Leakage
- Microthermal Imaging Based on the Transmission Change ...
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Materials Park, Ohio: ASM International, 1998
e20442507
eBooks Universitas Indonesia Library
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Contents :
- Terahertz Imaging: A New Technique for Inspection of Dielectric Materials
- Detecting Power Shorts from Front and Backside of IC Packages Using Scanning
SQUID Microscopy
- Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing
- Optical Probing of VLSI IC’s from the Silicon Backside
- Picosecond Imaging Circuit Analysis of the IBM G6 Microprocessor Cache
- Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated ...
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Materials Park, Ohio: ASM International, 1999
e20442508
eBooks Universitas Indonesia Library
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In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution up to 3.5 times better than without the lens. This method is easily implemented with standard equipment already present in most failure analysis laboratories, and ...
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Materials Park, Ohio: ASM International, 2005
e20442491
eBooks Universitas Indonesia Library
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Contents :
- Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip
Packaged Microprocessors
- Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis &
Microcharacterisation
- Application of Single Contact Optical Beam Induced Currents (SCOBIC) for
Backside Failure Analysis
- Measurement of Interfacial Adhesion and Its Degradation in Multi-Layer
Packages, Devices, And Blanket Films Using the Laser Spallation Technique
- ...
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Materials Park, Ohio: AsM International, 2000
e20442548
eBooks Universitas Indonesia Library
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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results ...
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Materials Park, Ohio: ASM International, 2008
e20442550
eBooks Universitas Indonesia Library
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Contents :
- IPFA 2002 Best Paper Award Winner
- SEM/SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of
Electronic Devices
- From Microns to Molecules–Can FA Remain Viable Through the Next Decade?
- Soft Defect Localization (SDL) on ICs
- Fault Localization and Functional Testing of ICs by Lock-in Thermography
- Visualisation of Electrically Active Areas Using Electron Holography
- A Study of Photoelectron Emission Microscopy Contrast ...
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Materials Park, Ohio: ASM International, 2002
e20442621
eBooks Universitas Indonesia Library
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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results ...
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Materials Park, Ohio: ASM International, 2010
e20451716
eBooks Universitas Indonesia Library
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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand and eliminate electronic device and system failures ...
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Materials Park, Ohio: ASM International, 2006
e20451852
eBooks Universitas Indonesia Library
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Contents :
- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging
Techniques in CMOS Failure Analysis
- Infrared Light Emission From Semiconductor Devices
- The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI
Circuits
- Golden Devices II: Alchemy in the 0.35 um Era
- Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip
- Two ...
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Materials Park, Ohio: ASM International, 1996
e20442490
eBooks Universitas Indonesia Library
