Ditemukan 18 dokumen yang sesuai dengan query
New York: McGraw-Hill, 1966
621.381 54 ELE (1)
Buku Teks Universitas Indonesia Library
Lenk, John D.
New Jersey: Prentice-Hall, 1982
R 621.381 LEN h
Buku Referensi Universitas Indonesia Library
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Contents :
- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging
Techniques in CMOS Failure Analysis
- Infrared Light Emission From Semiconductor Devices
- The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI
Circuits
- Golden Devices II: Alchemy in the 0.35 um Era
- Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip
- Two ...
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Materials Park, Ohio: ASM International, 1996
e20442490
eBooks Universitas Indonesia Library
Buchsbaum, Walter H.
Englewood Cliffs, New Jersey: Prentice-Hall, 1977
621.381 548 BUC c
Buku Teks Universitas Indonesia Library
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In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution up to 3.5 times better than without the lens. This method is easily implemented with standard equipment already present in most failure analysis laboratories, and ...
"
Materials Park, Ohio: ASM International, 2005
e20442491
eBooks Universitas Indonesia Library
"
Contents :
- Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip
Packaged Microprocessors
- Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis &
Microcharacterisation
- Application of Single Contact Optical Beam Induced Currents (SCOBIC) for
Backside Failure Analysis
- Measurement of Interfacial Adhesion and Its Degradation in Multi-Layer
Packages, Devices, And Blanket Films Using the Laser Spallation Technique
- ...
"
Materials Park, Ohio: AsM International, 2000
e20442548
eBooks Universitas Indonesia Library
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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results ...
"
Materials Park, Ohio: ASM International, 2008
e20442550
eBooks Universitas Indonesia Library
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Contents :
- IPFA 2002 Best Paper Award Winner
- SEM/SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of
Electronic Devices
- From Microns to Molecules–Can FA Remain Viable Through the Next Decade?
- Soft Defect Localization (SDL) on ICs
- Fault Localization and Functional Testing of ICs by Lock-in Thermography
- Visualisation of Electrically Active Areas Using Electron Holography
- A Study of Photoelectron Emission Microscopy Contrast ...
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Materials Park, Ohio: ASM International, 2002
e20442621
eBooks Universitas Indonesia Library
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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results ...
"
Materials Park, Ohio: ASM International, 2010
e20451716
eBooks Universitas Indonesia Library
"
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand and eliminate electronic device and system failures ...
"
Materials Park, Ohio: ASM International, 2006
e20451852
eBooks Universitas Indonesia Library
