Hasil Pencarian  ::  Simpan CSV :: Kembali

Hasil Pencarian

Ditemukan 4 dokumen yang sesuai dengan query
cover
" This volume highlights the latest developments and trends in advanced materials and their properties, the modeling and simulation of non-classical materials and structures, and new technologies for joining materials. It presents the developments of advanced materials and respective tools to characterize and predict the material properties and behavior ... "
Berlin : Springer, 2012
e20425852
eBooks  Universitas Indonesia Library
cover
" This monograph presents recent research findings on fracture properties and behavior of the composites, and their damage and cracking process under both quasi-static and impact loading conditions. Theoretical treatment, experimental investigation and numerical simulation aspects of the mechanics of composites, including sandwich structures are included ... "
Berlin: Springer-Verlag, 2012
e20397866
eBooks  Universitas Indonesia Library
cover
Zehnder, Alan T.
" This book develops the basic elements needed for both fracture research and engineering practice. The emphasis is on continuum mechanics models for energy flows and crack-tip stress- and deformation fields in elastic and elastic-plastic materials. In addition to a brief discussion of computational fracture methods, the text includes practical sections on fracture criteria, fracture toughness testing, and methods for measuring stress intensity factors and energy release rates. ... "
London: Springer, 2012
e20398303
eBooks  Universitas Indonesia Library
cover
Nancy Iwamoto, editor
" Molecular modeling and multiscaling issues for electronic material applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications. Part I presents ... "
New York: [Springer, ], 2012
e20418330
eBooks  Universitas Indonesia Library