Ditemukan 20 dokumen yang sesuai dengan query
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A text considering the various aspects of the application of image analysis to materials science problems, most especially engineering problems. A guide for applying image analysis to evaluate microstructural features in a variety of materials. Inlcudes bright, detailed color photographs and illustrations, as well as a wealth of black and white images. DLC: Metallography ...
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Materials Park, OH: ASM International, 2000
e20442170
eBooks Universitas Indonesia Library
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Contents :
- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging
Techniques in CMOS Failure Analysis
- Infrared Light Emission From Semiconductor Devices
- The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI
Circuits
- Golden Devices II: Alchemy in the 0.35 um Era
- Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip
- Two ...
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Materials Park, Ohio: ASM International, 1996
e20442490
eBooks Universitas Indonesia Library
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In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution up to 3.5 times better than without the lens. This method is easily implemented with standard equipment already present in most failure analysis laboratories, and ...
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Materials Park, Ohio: ASM International, 2005
e20442491
eBooks Universitas Indonesia Library
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Contents :
- Keynote Presentation
- Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That
an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup
- Session 1: Advanced Techniques
- Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in Shallow
Trench Isolation CMOS Structures: Correlation With Defect Generation and Diode
Leakage
- Microthermal Imaging Based on the Transmission Change ...
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Materials Park, Ohio: ASM International, 1998
e20442507
eBooks Universitas Indonesia Library
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Contents :
- Terahertz Imaging: A New Technique for Inspection of Dielectric Materials
- Detecting Power Shorts from Front and Backside of IC Packages Using Scanning
SQUID Microscopy
- Waveform Acquisition from the Backside of Silicon Using Electro-Optic Probing
- Optical Probing of VLSI IC’s from the Silicon Backside
- Picosecond Imaging Circuit Analysis of the IBM G6 Microprocessor Cache
- Electrical Probing and Surface Imaging of Deep Sub-Micron Integrated ...
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Materials Park, Ohio: ASM International, 1999
e20442508
eBooks Universitas Indonesia Library
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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results ...
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Materials Park, Ohio: ASM International, 2008
e20442550
eBooks Universitas Indonesia Library
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Contents :
- Preface
- The Use of Ion Exchange Compounds as Corrosion Inhibiting and Sensing
Pigments in Organic Coatings
- A Novel Self-Priming Coating for Corrosion Protection
- SVET Investigations of Protection Mechanism of Mg-rich Primer on Al 2024
- Development of Ni-Si-Nb APS Coatings for Sulfuric Acid Resistance
- Salt Fog Corrosion Testing of Al-Y-Co based Nanocrystalline and Amorphous
Coatings Produced by Atmospheric Plasma ...
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Materials Park, Ohio: ASM International, 2005
e20442577
eBooks Universitas Indonesia Library
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Contents :
- Recent Developments in the Understanding of Stainless Steel Welding Metallurgy
- Tailoring the Phase Balance During Laser and GTA Keyhole Welding of SAF
2205 Duplex Stainless Steel
- Pitting Corrosion Resistance of Duplex Stainless Steels Multipass Welds
- Investigation of the Kinetics of the Ferrite/Austenite Phase Transformation in the
HAZ of a 2205 Duplex Stainless Steel Weldment
- Effect of GTAW Flux on the Microstructure and ...
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Materials Park, Ohio: ASM International, 2003
e20442612
eBooks Universitas Indonesia Library
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Contents :
- IPFA 2002 Best Paper Award Winner
- SEM/SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of
Electronic Devices
- From Microns to Molecules–Can FA Remain Viable Through the Next Decade?
- Soft Defect Localization (SDL) on ICs
- Fault Localization and Functional Testing of ICs by Lock-in Thermography
- Visualisation of Electrically Active Areas Using Electron Holography
- A Study of Photoelectron Emission Microscopy Contrast ...
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Materials Park, Ohio: ASM International, 2002
e20442621
eBooks Universitas Indonesia Library
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Contents :
- Session 1: Advanced Techniques
- Scanning Magnetoresistive Microscopy for Die-Level Sub-Micron Current Density
Mapping
- High Resolution Current Imaging by Direct Magnetic Field Sensing
- Fault Isolation of High Resistance Defects using Comparative Magnetic Field
Imaging
- High Resolution Backside Thermography using a Numerical Aperture Increasing
Lens
- Session 2: Optical Techniques
- Study of Critical Factors Determining Latchup Sensitivity of ...
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Materials Park, Ohio: ASM International, 2003
e20442631
eBooks Universitas Indonesia Library
