Ditemukan 1 dokumen yang sesuai dengan query
Yudan Whulanza
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This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an exposure of 7.5 Volts of Direct Current (VDC) for 30 seconds. The thickness of electroplated metal is at a ...
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Depok: Faculty of Engineering, Universitas Indonesia, 2015
UI-IJTECH 6:6 (2015)
Artikel Jurnal Universitas Indonesia Library
