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Ditemukan 7468 dokumen yang sesuai dengan query
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Skrzypek, Jacek J.
Berlin: Springer, 1999
620.112 26 SKR m
Buku Teks SO  Universitas Indonesia Library
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Nancy Iwamoto, editor
"Molecular modeling and multiscaling issues for electronic material applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications. Part I presents the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue. Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example of the use of quasi-continuum methods that are being used to address multiscaling issues. Part III is a more specific look at molecular dynamics in the determination of the thermal conductivity of carbon-nanotubes. Part IV covers the many aspects of molecular modeling needed to understand the relationship between the molecular structure and mechanical performance of materials. Finally, part V discusses the transitional topic of multiscale modeling and recent developments to reach the submicronscale using mesoscale models, including examples of direct scaling and parameterization from the atomistic to the coarse-grained particle level."
New York: [Springer, ], 2012
e20418330
eBooks  Universitas Indonesia Library
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Talreja, Ramesh
Cambridge, UK: Cambridge University Press, 2012
620.112 6 TAL d
Buku Teks SO  Universitas Indonesia Library
cover
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Dordrecht, The Netherlands: Springer Verlag , 2009
620.112 6 DAM
Buku Teks SO  Universitas Indonesia Library
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McPherson, J.W.
"This third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes-all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases.
- Provides a comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications;
- Explains the fundamentals of reliability physics and engineering tools for building better products;
- Contains statistical training and tools within the text;
- Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation."
Switzerland: Springer Nature, 2019
e20509885
eBooks  Universitas Indonesia Library
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German: Wiley-VCH, 2003
572.33 MOL
Buku Teks  Universitas Indonesia Library
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Kelly, S. Graham
Boca Raton: CRC Press, 2009
620.001 5 KEL a
Buku Teks SO  Universitas Indonesia Library
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Hernandez, Edwin A. Peraza
"Origami structures have the ability to be easily fabricated from planar forms, enable the deployment of large structures from small volumes, and are potentially reconfigurable. These characteristics have led to an increased interest in theoretical and computational origami among engineers from across the world. In this book, the principles of origami, active materials, and solid mechanics are combined to present a full theory for origami structures. The focus is on origami structures morphed via active material actuation and formed from sheets of finite thickness. The detailed theoretical derivations and examples make this an ideal book for engineers and advanced students who aim to use origami principles to develop new applications in their field."
Switzerland: Springer Cham, 2019
e20501791
eBooks  Universitas Indonesia Library
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Roloff, Sascha
"This book covers two main topics: First, novel fast and flexible simulation techniques for modern heterogeneous NoC-based multi-core architectures. These are implemented in the full-system simulator called InvadeSIM and designed to study the dynamic behavior of hundreds of parallel application programs running on such architectures while competing for resources. Second, a novel actor-oriented programming library called ActorX10, which allows to formally model parallel streaming applications by actor graphs and to analyze predictable execution behavior as part of so-called hybrid mapping approaches, which are used to guarantee real-time requirements of such applications at design time independent from dynamic workloads by a combination of static analysis and dynamic embedding."
Singapore: Springer Singapore, 2019
e20503042
eBooks  Universitas Indonesia Library
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