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"The Materials & Processes for Medical Devices Conference focuses on the materials science and engineering aspects of the medical devices industry. Device manufacturers, materials providers, and clinicians share information and knowledge on materials and their properties. Coverage ranges from cardiovascular devices to orthopedics to dental appliances."

"Contents :- Microscopy at the Nanoscale - Polarization Difference Probing: A New Phase Detection Scheme for Laser Voltage Probing - Spray Cooling for Time Resolved Emission Measurements of ICs - A Novel Technique for Detecting High Resistance Fault Using Electroplating - Magnetic Current Imaging Techniques: Comparative Case Studies - Electrical Characterization of sub-30nm Gatelength Soi Mosfets - Combination of SCM/SSRM Analysis and Nanoprobing Technique for Soft Single Bit Failure Analysis - Current Image Atomic Force Microscopy (CI-AFM) Combined with Atomic Force Probing (AFP) for Location and Characterization of Advanced Technology Node. - Towards High Accuracy Fault Diagnosis of Digital Circuits - Broken Scan Chain Diagnostics based on Time-Integrated and Time-Dependent Emission Measurements - Hardware Results Demonstrating Defect Localization Using Power Supply Signal Measurements - Scanning SQUID Microscopy for New Package Technologies - Failure Analysis of Short Faults on Advanced Wire-bond and Flip-chip Packages with Scanning SQUID Microscopy - A Novel Approach to Identifying and Validating Electrical Leakage in Printed Circuit Boards through Magnetic Current Imaging - Extracting Acoustic signatures of Solder Bump Defects using Wavelet Power Spectra and their Classification using Normalized Cross- Correlation. - A Novel X-ray Microtomography System with High Resolution and Throughput For Non-Destructive 3D Imaging of Advanced Packages - Fault Isolation of Large Nets Using Bridging Fault Analysis - Cavity Up and Stack Die Backside Failure Analysis for Thin Die and High Pin Count Devices - Investigation of Substrate Dislocation Induced Bit Line Soft Failure - Overcoming Environmentally Induced Probe Drift for Sub-300nm Fault Isolation - Dislocation Induced Leakage of p+-Implanted ESD Test Macros in 90nm Technology - A Purpose-Driven Decision-Based Methodology for Debug and Failure Analysis - Improved Electrical Failure Analysis / Fault Isolation Tool Development on Server Motherboard Platforms based on Historic Failure Modes - Intel® Component Diagnostic Technology: Tools and Education for Intel Component Defect Reduction - Capacity Management Solutions - A Novel Approach for Enhancing Critical FIB Imaging for Failure Analysis and Circuit Edit Applications - Contacting Silicon with FIB for Backside Circuit Edit - IC Specification Improvement Through Direct Passive Component Modification in the FIB - FIB Chip Repair: Improving Success by Controlling Beam-Induced Damage and Thermal / Mechanical Stress - Precise Fail site Isolation using a combination of Global, Software and Tester based Isolation Techniques - Optimised Probing Flow for High Speed Fault Localization - Diagnostic Fault Simulation for the Failure Analyst - Diagnosing DACS (Defects That Affect Scan Chain and System Logic) - Timing Analysis of a Microprocessor PLL using High Quantum Efficiency Superconducting Single Photon Detector (SSPD) - Analysis of 0.13 um CMOS Technology Using Time Resolved Light Emission - Photon Emission Microscopy in 90 nm CMOS Technologies - Quantifying the Work of Adhesion Between an AFM Cantilever Tip and MEMS Test Structures After Packaging - Reliability of Polycrystalline MEMS : Prediction of the Debugging-time - Failure Analysis of Electrothermal Actuators Subjected to Electrical Overstress (EOS) and Electrostatic Discharge (ESD) - Detecting the 10 Angstroms that Changes MEMS Performance - Scanning Electron Microscope Induced Electrical Breakdown of Tungsten Windows in Integrated Circuit Processing - The Effect Temperature and Strain Rate on Selected Lead Free Solder Alloys - Semiconductor Inter-Material Analysis using a FIB Sample Preparation Method and Auger Depth Profiling - Identification and Characterization of Ultra-thin (<100 nm) Flakes Using a Combination of Face-lapping, High Energy (10 kV) SEM Imaging, and TEM - Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint - Measurement of Solder Joint Strength and its Dependence on Thermal Aging in Freestanding and Board-Mounted Packages Using a Laser Spallation Technique - A Methodology for Characterizing System-Level ESD Sensitivity - Design and Process Related Failure Detection with Reliability Testing Incorporating Varying Power Sequencing and Slew Rate - A Study of Power Plane Shapes, Their Contribution to Inter-Planar Electric Field Intensities, and Pre-Preg Breakdown - Characterization of VCSEL-array Degradation Induced by Elevated Temperature and Humidity - FiberQA-AVIT System "

"The two-volume set LNCS 7649 + 7650 constitutes the refereed proceedings of the 11th International Semantic Web Conference, ISWC 2012, held in Boston, MA, USA, in November 2012. The International Semantic Web Conference is the premier forum for Semantic Web research, where cutting edge scientific results and technological innovations are presented, where problems and solutions are discussed, and where the future of this vision is being developed. It brings together specialists in fields such as artificial intelligence, databases, social networks, distributed computing, Web engineering, information systems, human-computer interaction, natural language processing, and the social sciences. Volume 1 contains a total of 41 papers which were presented in the research track. They were carefully reviewed and selected from 186 submissions. Volume 2 contains 17 papers from the in-use track which were accepted from 77 submissions. In addition, it presents 8 contributions to the evaluations and experiments track and 7 long papers and 8 short papers of the doctoral consortium."

"The two-volume set LNCS 7649 + 7650 constitutes the refereed proceedings of the 11th International Semantic Web Conference, ISWC 2012, held in Boston, MA, USA, in November 2012. The International Semantic Web Conference is the premier forum for Semantic Web research, where cutting edge scientific results and technological innovations are presented, where problems and solutions are discussed, and where the future of this vision is being developed. It brings together specialists in fields such as artificial intelligence, databases, social networks, distributed computing, Web engineering, information systems, human-computer interaction, natural language processing, and the social sciences. Volume 1 contains a total of 41 papers which were presented in the research track. They were carefully reviewed and selected from 186 submissions. Volume 2 contains 17 papers from the in-use track which were accepted from 77 submissions. In addition, it presents 8 contributions to the evaluations and experiments track and 7 long papers and 8 short papers of the doctoral consortium."

"This book include the course of recent anthropological fieldwork among the Basemah in the highlands of South Sumatra, study a number of heirloom manuscripts. These texts are written in a syllabic script apparently derived from Pallava writing of South India. At this point cannot assign a certain date to the introduction of the script to South Sumatra, but it is likely that the several South Sumatran highland peoples who have a literature in this script,received the writing from contact with the Empire of Srivijaya which flourished between the seventh and thirteenth centuries in the Palembang lowland area.A philological study of the South Sumatran literature be required a level of competence in several Sumatran languages and Javanese as well as Arabic and Sanskrit. That relate to agricultural development.An examination of ilmu in this way may begin to reveal a style of social interaction, a mode of perceiving and evaluating others and an attitude toward effective action and the constellation of important values that prevail throughout the Malay world."